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EB-115 – Unfilled High Temperature Epoxy Adhesive
EB-115 is an unfilled epoxy adhesive that can withstand extremely high temperatures. Able to withstand... -
EC-M22 – Long Potlife Underfill
EC-M22 is a highly filled, low stress, liquid encapsulant designed to be used an underfill... -
Thermally Conductive, Low Expansion Epoxy Potting Compound
EC-1017 is a medium viscosity, thermally conductive epoxy potting compound excellent for potting high voltage...
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