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MICROELECTRONIC LIQUID ENCAPSULANTS

SEMICONDUCTOR PACKAGING ■ FLIP CHIP UNDERFILL ■ GLOB TOP

FEATURES

APPLICATION

Product

Pot Life

Sp. Gravity

Viscosity @ 25°C (cps)

Cure Schedule

Coefficient of Thermal Expansion (10-6/°C)

Tg. (°C)

Operating Temperature Range

Thermal Conductivity (W/m°K)

Volume Resistivity (Ohm-cm)

-40°C

To

25°C

25°C to

120°C

-Low thermal expansion

 

-Good moisture resistance

 

-Excellent thermal cycle performance

 

-Fast flow rate cavity fill

-Chip-On-Board

 

-Semiconductor Packaging

M-3022

>8 hrs @ 25°C

1.69

50,000

4 hrs @ 150°C

25

32

146

-55°C to 150°C

0.7

3x1014

M-3023

>8 hrs @ 25°C

1.76

39,000

30 min @ 100°C+

2 hrs @ 165°C

22

25

151

-55°C to 150°C

0.75

1x1015

M-3024

>8 hrs @ 25°C

1.82

48,000

4 hrs @ 150°C

22

24

152

-55°C to 150°C

0.8

2x1014

M-3025

>8 hrs @ 25°C

1.75

24,000

1 hr @ 80°C+

2 hrs @ 150°C

24

28

148

-55°C to 150°C

0.75

3x1015

M-3026

>8 hrs @ 25°C

1.82

85,000

30 min @ 100°C+

2 hrs @ 165°C

20

22

156

-55°C to 150°C

0.8

1x1014

M-3028

>8 hrs @ 25°C

1.77

100,000

4 hrs @ 150°C

 

22

25

158

-55°C to 150°C

0.75

3x1014

-Low thermal expansion

 

-Good moisture resistance

 

-Excellent thermal cycle performance

 

-Fast flow rate

 

-Very good adhesion

Flip Chip Underfill (under 2 mils)

M-3110

2 days @ 25°C

1.76

5100

1 hr @ 100°C+

1 hrs @ 150°C

26

34

130

-40°C to 150°C

0.75

2x1015

M-3112

>8 hrs @ 25°C

1.82

32,000

1 hr @ 80°C+

2 hrs @ 150°C

23

30

143

-55°C to 150°C

0.8

7x1014

M-3116

>8 hrs @ 25°C

1.73

14,000

2 hrs @ 150°C

22

29

150

-55°C to 150°C

0.75

1x1015

-Low thermal expansion

 

-Good moisture resistance

 

-Excellent thermal cycle performance

 

-Thixotropic

 

-Very good adhesion

Glob Top Encapsulants for high and low profile

GT-3221

>8 hrs @ 25°C

1.72

280,000

1 hr @ 80°C+

2 hrs @ 150°C

25

37

124

-55°C to 150°C

0.75

>1014

GT-3222

>8 hrs @ 25°C

1.67

90,000

1 hr @ 100°C+

2 hrs @ 165°C

27

39

146

-55°C to 150°C

0.7

1x1015

GT-3224

>8 hrs @ 25°C

1.76

130,000

1 hr @ 100°C+

2 hrs @ 165°C

23

32

156

-55°C to 150°C

0.75

4x1014
                           

 

FEATURES

APPLICATIONS

Product

Shelf Life

Pot Life

Sp. Gravity

Viscosity @ 25°C (cps)

Cure Schedule

Coefficient of Thermal Expansion

 (10-6/°C)

Tg (°C)

Operating Temp. Range

Thermal Conductivity (W/m°K)

Volume Resistivity (Ohm-cm)

-40°C to 25°C

25°C to 120°C

Ø   Low thermal expansion

Ø   Good moisture resistance

Ø   Excellent thermal cycle performance

Ø   One and two components

Ø   Very good adhesion

Ø     Substrate Attach

Ø     Lid Seal

Ø     SMD Attach

Ø     Stacking component

Ø     Die Attach applications

o   Chip-On-Board

o   LED

o   TCP

o   MCM-L,C, & D

EB-316TM

1 year @ 25°C

45 Min @25°c

1.35

Paste

1 hrs @ 160°C

77

-

109

-55°C to 150°C

0.5

3x1013

EB-315

1 year @ 25°C

90 Min @25°c

1.8

Paste

1 hrs @ 175°C

25

40

182

-55°C to 230°C

0.7

2x1015

EB-350-3T

4 months @ 25°C

20 Min @80°C

1.5

Non-Sag Paste

1 hrs @ 150°C

32

41

120

-55°C to 150°C

1.0

1x1015

EB-402-1

1 year @

-40°C

12 Min @ 125°C

2.14

>250,000

2 hrs @ 125°C

24

33

145

-55°C to 150°C

1.8

2x1015

EB-403-1

1 year @

-40°C

30 Min @80°C

2.1

Non-Sag Paste

1/2 hr @ 150°C

28

38

145

-55°C to 150°C

1.75

6x1015

EB-404-1

4 months @ 25°C

10 Min @80°C

1.6

40,000

1/2 hr @ 150°C

39

51

130

-55°C to 150°C

1.2

3x1015

EB-414-1

1 year @

-40°C

12 Min @ 125°C

2.1

20,000

1/2 hr @ 150°C

35

48

124

-55°C to 150°C

1.6

2x1015

EB-407

1 year @

25°C

2 hrs @ 25°C

2.3

Paste

1/2 hrs @ 100°C

27

60

77

-40°C to 120°C

1.3

7x1015

EB-425

1 year @

25°C

>4 hrs @ 25°C

2.3

>250,000