EPOXIBOND-106
May 1, 2012
EPOXIBOND-106 is a arguably one of Epoxyset’s most used and most versatile adhesive. This non-filled, low viscosity, optically clear epoxy can be used in almost any industry ranging from aerospace, to electronics packaging, to medical device manufacturing. Used as a bonding adhesive, sealant, or potting material for small packaging, EB-106 has a work life of…
-EC-M22LV-1
April 20, 2012
EPOXICAST -M22LV-1 is a low viscosity, liquid epoxy encapsulant designed as an underfill for flip chip devices. EC-M22LV-1 features low coefficient of thermal expansion properties and improved toughness. When fully cures, this EC-M22LV-1 forms a rigid, low stress, seal that dissipates stress on solder joints improving performance on thermal cycling. This material is specially suited…
-EC-1015 is a thermally conductive, low viscosity epoxy potting compound excellent for potting densely packaged electronic parts. EC-1015 has a very long pot life making it a great option for high volume use. This material will cure in 4 hours at temperatures at 125°C. Curing at these high temperature results in high heat resistance, glass…
-EB-406 – Thermally Conductive, Fast Cure Adhesive
March 9, 2012
EB-406 is fast curing, thermally conducive epoxy adhesive designed for bonding applications that require a quick fixture time as well as high heat transfer. EB-406 will begin to gel within 20 minutes after mixing and has a fixture time of 1-2 hours. Once mixed it will fully cure within 8 hours of mixing. EB-406 was…
-EB-108 – Low Viscosity, High Bond Strength Epoxy
February 8, 2012
Epoxyset EB-108 is a low viscosity, high strength epoxy system that is widely used in the aerospace, medical, and electronics industries for a wide range of bonding applications and has passed rigorous testing for bond strength and fatigue. This epoxy system ideally uses heat to cure but can also cure at room temperature. EB-108 exhibits…
-EB-115 – Unfilled High Temperature Epoxy Adhesive
November 2, 2011
EB-115 is an unfilled epoxy adhesive that can withstand extremely high temperatures. Able to withstand temperatures up to 230°C continuously and 300°C intermittently before losing significant properties. A medium-low viscosity allows the EB-115 system to be easily applied or dispensed. It is an excellent epoxy for bonding glass, metals, ceramics, and most plastics, EB-115 is…
-EC-M22 – Long Potlife Underfill
October 12, 2011
EC-M22 is a highly filled, low stress, liquid encapsulant designed to be used an underfill with a dam or to pot a cavity for electronics packaging and flip chip underfill on PCBs. This product has a very long pot life (>8 hrs), high Tg and a low coefficient of thermal expansion. When used in conjunction…
-Thermally Conductive, Low Expansion Epoxy Potting Compound
October 4, 2011
EC-1017 is a medium viscosity, thermally conductive epoxy potting compound excellent for potting high voltage power supplies. With a CTE of 21 in/in/10x-6, it is a great option if thermal expansion is an issue. Able to withstand high temperatures, EC-1017 offers a very high glass transition temperature and will not break down. This product is…
-Epoxyset Pre-Mixed & Frozen Epoxy Products
September 21, 2011
Epoxyset specializes in providing many of our products in premixed and frozen packaging. Epoxyset Freeze-Pack syringes or cartridges eliminate the need for you to accurately weigh and mix reactive resin materials. Material stored in your freezer is simply thawed before use and then applied. We provide a thoroughly blended resin system that is…
-EB-177
September 8, 2011
EB-177 is a two component, high Tg, optical adhesive. EB-177 has a very low viscosity and excellent handling properties. With an easy 1:1 mix ratio by weight, this product can be mixed by hand and applied by hand, brushing, dipping, or automated dispensing. Excellent product for potting and encapsulating small electronic components or as an…
-
