EB-108 – Low Viscosity, High Bond Strength Epoxy
February 8, 2012
Epoxyset EB-108 is a low viscosity, high strength epoxy system that is widely used in the aerospace, medical, and electronics industries for a wide range of bonding applications and has passed rigorous testing for bond strength and fatigue. This epoxy system ideally uses heat to cure but can also cure at room temperature. EB-108 exhibits excellent bond strength, long work life (2 hrs), and high moisture resistance. Review EB-108 data sheet by clicking here.
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Epoxyset’s core belief is to provide quality products with unprecedented service to our customers. We are a custom formulator of epoxies, silicones and urethanes for demanding applications in MicroElectronics / Electronics, Aerospace, Automotive, Medical and Industrial applications.
Tags: epoxy, epoxy adhesive, epoxy resin, epoxyset, high temperature epoxy adhesive, low viscosity, medical adhesive, medical adhesives, medical device adhesive, medical grade, optical adhesive, optical products